Effect and Utilization of Common Source Inductance in Synchronous Rectification
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- as presented at APEC 2005 -
Analysis of Avalanche Behaviour for Paralleled MOSFETs
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- as presented at SAE World Congress 04 -
DirectFET Power MOSFET Packaging Technology Enables Discrete Multiphase Converter Design Capable of up to 2MHz/phase Operation
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Low Voltage Super Junction MOSFET Simulation and Experimentation
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New Trench MOSFET Technology for DC-DC Converter Applications
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DirectFET Technology: A Mechanically Robust Surface Mount Technology
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High Current Voltage Regulator Module (VRM) Uses DirectFET MOSFETs to Achieve Current Densities of 25V/in2 at 1MHz to Power 32-bit Servers
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High Current Voltage Regulator Module Employs Novel Packaging Technology to Achieve over 100A in A Compact Footprint to Power Next Generation Servers
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DirectFET - A Proprietary New Source Mounted Power Package for Board Mounted Power
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The Mechanical Ruggedness of DirectFET
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20V MOSFETs for DC-DC Converters in Desktop Computers and Servers
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Bi-directional FlipFET MOSFETs for Cell Phone Battery Protection Circuits
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FlipFET MOSFET Design for High Volume SMT Assembly
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Extremely Rugged MOSFET Technology with Ultra-low RDS(on) Specified for A Broad Range of EAR Conditions
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- As presented at PCIM 2000
Power MOSFET Basics
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Paralleling of Power MOSFETs for Higher Power Output
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IGBT or MOSFET: Choose Wisely
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Evaluation of Power MOSFET Thermal Solutions for Desktop and Mobile Processor Power
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Novel Power MOSFET Packaging Technology Doubles Power Density in Synchronous Buck Converters for Next Generation Microprocessors
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Flip Chip MOSFET: A New Wafer Scale Packaging Technique
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New Power MOSFETs Enable 3% Efficiency Gain in DC-DC Converters
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